Supermicro

1. Dual Root System for balanced
    performance & higher CPU
    to GPU communication
2. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
3. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
4. 8 PCI-E 3.0 x16 slots
    (support up to 8 double width GPU),
    2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4
5. Up to 24 Hot-swap 2.5" drive bays;
    8x 2.5" SATA drives supported
    with included H/W, 2x 2.5" NVMe
    drives supported with included H/W,
    1 NVMe based M.2 SSD
6. 2x 10GBase-T LAN ports via Intel C622
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
    Supplies Titanium Level (96%+)

1. Single Root System for excellent
    GPU peer to peer communication
    with sufficient CPU to GPU throughput
2. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
3. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
4. 11 PCI-E 3.0 x16 (FH, FL) slots
    1 PCI-E 3.0 x8 (FH, FL in x16 slot)
5. Up to 24 Hot-swap 2.5" drive bays;
    8x 2.5" SATA drives supported
    with included H/W, 2x 2.5" NVMe
    drives supported with included H/W,
    1 NVMe based M.2 SSD
6. 2x 10GBase-T LAN ports via Intel C622
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
    Supplies Titanium Level (96%+)

1. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 20 PCI-E 3.0 x16 support
    up to 20 single width GPU;
    1 PCI-E 3.0 x8 (FH, FL in x16 slot)
4. 24 Hot-swap 3.5" drive bays or
    22 Hot-swap 3.5" drive bays +
    2 U.2 NVMe 2.5" drives
5. 2x 10GBase-T LAN ports
6. 8 Hot-swap 92mm RPM cooling fans
7. 2000W (2+2) Redundant Power
    Supplies Titanium Level (96%+)

 Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16 (double-width) slots,
    2 PCI-E 3.0 x16 (single-width) slots,
    1 PCI-E 3.0 x4 (in x8) slot
4. 8 Hot-swap 3.5" drive bays
5. 2x 10GBase-T LAN ports
6. 1 VGA, 2 COM, 5 USB 3.0
7. 4 Heavy duty fans, 4 exhaust fans,
    and 2 active heatsink with optimal
    fan speed control
8. 2200W Redundant Power Supplies
    Titanium Level (96%)
9. GPU Kit for passive GPU support
    (MCP-320-74702-0N-KIT)

1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 16 DIMM slots
3. 4 PCI-E 3.0 x16 slots
    2 PCI-E 3.0 x8 (1 in x16) slots
    support Thunderbolt 2.0 AOC,
    1 PCI-E 2.0 x4 (in x8) slot;
    Up to 4 NVIDIA® GPU
4. I/O ports: 1 VGA, 2 COM, 2 GbE,
    10 USB 2.0, & 1 IPMI Dedicated LAN
5. 8 Hot-swap 3.5", 3 Fixed 5.25"
    and 1 Fixed 3.5" Drive Bays
6. 4 Heavy Duty Fans, 2 Exhaust
    Fans, and 2 Active Heatsink with
    Optimal Fan Speed Control
7. 2000W High efficiency (96%)
    Redundant PSU; Titanium Level
8. Tower or Rackmount
9. GPU Kit for passive GPU/Xeon Phi
    support (MCP-320-74701-0N-KIT)

 Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
    DDR4- 2400†MHz ; 24 DIMM slots
3. Expansion slots:
    8 PCI-E 3.0 x16 (double-width) slots
    2 PCI-E 3.0 x8 (in x16) slots
    1 PCI-E 2.0 x4 (in x16) slot
4. Dual GbE LAN with Intel® i350
5. 24 Hot-swap 2.5" drive bays
6. 8 Hot-Swap 92mm cooling fans
7. 1600W Redundant (2+2) Power
    Supplies; Platinum Level (94%+)